YX-AC6601 BMS Board for 3S-5S, 5-20A Discharge, 2A Capacitive Balancing

The YX-AC6601 BMS Board is designed for 3S to 5S battery packs, offering a continuous discharge current range of 5A to 20A. With a maximum balancing current of 2A, this board ensures efficient and balanced energy distribution across the cells, improving battery performance and extending its lifespan.

Using Capacitive Active Balancing technology, the board redistributes energy from higher voltage cells to lower voltage ones, preventing imbalances and ensuring efficient operation. The Apesilicon AC6601 chip provides stable and reliable performance, even under varying environmental conditions.

With its compact size of 7442.78.4mm, the board is easy to integrate into Battery Management Systems (BMS) for electric vehicles, energy storage systems, and other applications requiring precise battery management. The XHB-2.54 connector ensures secure and simple installation, while the SMT (Solderable) NTC temperature sensor continuously monitors the battery temperature to enhance safety.

The TO-252-3L MOS package and 30V MOS voltage provide reliable performance, and the board operates without a heatsink, making it perfect for lower-power applications.

Key Features:

• Supports 3S to 5S Battery Packs: Ideal for small to medium voltage configurations.
• Continuous Discharge Current of 5A to 20A: Perfect for low-to-medium power applications.
• Max Balancing Current of 2A: Ensures efficient energy balancing across the battery pack.
• Capacitive Active Balancing Technology: Redistributes energy to prevent imbalance and optimize battery health.
• Apesilicon AC6601 Chip: Reliable, stable performance under varying conditions.
• Compact Size: Measures 7442.78.4mm, ideal for BMS integration.
• XHB-2.54 Connector: Provides easy and secure connectivity for seamless installation.
• SMT Temperature Sensor: Continuous temperature monitoring for enhanced safety.
• Wire Soldering: Flexible soldering options for installation.
• TO-252-3L MOS Package: 30V MOS voltage for reliable operation.
• No Heatsink: Ideal for low-power applications without additional thermal management.