YX-AC6611 BMS Board for 9S, 5-20A Discharge, 2A Capacitive Balancing
- Product Type: BMS Board (Protection + Active Balancing)
- Supported Series: 9S
- Continuous Discharge Current: 5~20A
- Max Balancing Current: 2A
- Size: 88.951.98.4mm
- Chip Series: Apesilicon AC6601+AC6611
- Balancing Method: Capacitive Active Balancing
- Connector: XH-2.54
- NTC: SMT (Solderable)
- Port Type: Common Port
- Soldering Type: Wire Soldering
- MOS Package: TO-252-3L
- MOS Voltage: 30V
- Heatsink: No Heatsink
- Version: YX-AC6611-6601-9S2A-CT-EB-V01
- Product overview
The YX-AC6611 BMS Board is designed for 9S battery packs, offering a continuous discharge current range of 5A to 20A. With a maximum balancing current of 2A, this board ensures precise energy balancing and optimizes the performance and lifespan of your battery pack.
Utilizing Capacitive Active Balancing technology, the board redistributes energy from higher voltage cells to lower voltage cells, preventing imbalances and promoting efficient energy usage. Powered by the reliable Apesilicon AC6601+AC6611 chip series, it provides stable operation even under challenging conditions.
This compact board, with a size of 88.951.98.4mm, is easy to integrate into Battery Management Systems (BMS). The XH-2.54 connectors provide a secure and reliable connection, while the SMT (Solderable) NTC temperature sensor continuously monitors the battery’s temperature to enhance safety. The board supports wire soldering for flexibility in installation.
The TO-252-3L MOS package and 30V MOS voltage ensure efficient, reliable operation, and the board operates without a heatsink, making it ideal for lower-power applications.
Key Features:
- Supports 9S Battery Packs: Designed for 9S battery configurations.
- Continuous Discharge Current of 5A to 20A: Suitable for low-to-medium power applications.
- Max Balancing Current of 2A: Efficient energy balancing for optimal battery performance.
- Capacitive Active Balancing Technology: Ensures even energy distribution and prevents imbalance.
- Apesilicon AC6601+AC6611 Chip: Reliable and stable performance under various conditions.
- Compact Size: Measures 88.951.98.4mm, perfect for BMS integration.
- XH-2.54 Connectors: Secure, easy connectivity for system integration.
- SMT Temperature Sensor: Provides continuous temperature monitoring for safety.
- Wire Soldering: Flexible installation options for your system.
- TO-252-3L MOS Package: 30V MOS voltage for reliable performance.
- No Heatsink: Ideal for low-power applications without additional thermal management.
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