YX-AC6601 BMS Board for 4S, 40-100A Discharge, 5A Active Balancing

The YX-AC6601 BMS Board is designed for 4S battery packs and offers a continuous discharge current range of 40A to 100A, making it perfect for high-power applications. With a maximum balancing current of 5A, this module ensures precise energy distribution across cells, preventing imbalances and extending battery lifespan.

Utilizing Inductive Active Balancing technology, the board efficiently redistributes energy from higher voltage cells to lower voltage cells, ensuring balanced performance. Powered by the reliable Apesilicon AC6601 chip series, it provides stable operation even in demanding environments.

This board comes with XHB-2.54-4P connectors for easy integration and SMT (Solderable) NTC temperature monitoring for enhanced safety. The M5 Screw Terminal supports 40–60A wire soldering, with an optional screw terminal for secure connections. The TOLLA-8L MOS package ensures robust performance, and the single-side heatsink improves thermal management, reducing the risk of overheating.

With its compact size of 114.574.517mm, the module is ideal for Battery Management Systems (BMS) in applications like electric vehicles, energy storage, and high-performance power systems.

Key Features:

• Supports 4S Battery Packs: Ideal for medium-voltage configurations.
• Continuous Discharge Current of 40-100A: Suitable for high-power applications.
• Max Balancing Current of 5A: Ensures precise balancing for optimal battery performance.
• Inductive Active Balancing Technology: Efficiently redistributes energy for balanced charge.
• Apesilicon AC6601 Chip: Reliable, stable performance for demanding conditions.
• Compact Size: Measures 114.574.517mm, perfect for BMS integration.
• XHB-2.54-4P Connectors: Easy to connect and secure for seamless system integration.
• SMT Temperature Sensor: Provides real-time temperature monitoring for enhanced safety.
• M5 Screw Terminal: Supports 40–60A wire soldering and optional screw terminal for secure connections.
• Single-Side Heatsink: Helps improve thermal dissipation for better performance.